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    晶圆厚度自动测量机04.jpg1-220R0110055X0.jpg



    WAFER厚度自动测量分为接触及非接触式测量,可以自动测量陶瓷盘上wafer厚度;

    1、检测陶瓷盘范围:3片、5片、7片、9片,可拓展;

    2、检测厚度范围:0μm-1500μm

    3、厚度检测重复精度:±1μm(接触)、0.5(非接触)

    4、标准盘校验误差:±2μm(校验材质与被检测材质一致)

    5、检测准确性:≥99.5%

    6、分辨率:0.1μm(接触)、0.01μm(非接触)



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